Semiconductor part processing is a complex and delicate process involving multiple key steps and technologies. The cutting methods in semiconductor parts processing mainly include the following:
1) Blade cutting
Full cutting: The complete cutting of the workpiece by cutting to the fixed material (such as cutting tape) is the basic processing method in semiconductor manufacturing.
Half cut: Cut into the middle of the workpiece to create a groove, often used in DBG processes to simultaneously thin and separate the chip by grinding.
Double cutting: Use a double cutting saw to make a full or half cut on both lines at the same time to increase production.
Step cutting: Full cutting and half cutting in two stages using a double slotting machine with two spindles, often used to deal with wiring layers.
Bevel cutting: In a step-by-step cutting process, the wafer is cut in two stages using a blade with a V-shaped edge on the semi-cutting side for high die strength and high quality machining.
Shredder cutting: The blade is lowered from the workpiece directly above and cut into the workpiece vertically, often used for local slotting.
Chopper traverse: Cutting the workpiece by moving the workpiece horizontally during the chopper cutting process, suitable for partial cutting.
Round cutting: After the cutting machine, the workpiece is cut into a circle by rotating the processing table.
Inclined cutting (inclined Angle spindle) : Cutting at a certain Angle is achieved by installing an inclined spindle on the machining table for processes requiring Angle cuts.
2) Laser cutting
Using laser technology to separate wafers into grains involves delivering a high concentration of photon streams onto the wafers, generating local high temperatures to remove the cut channel area.
The cost of laser cutting is relatively high, but it can achieve high precision and high efficiency processing.
3) Micro-cutting
Using high resolution solid micro tools, workpiece allowance is removed by mechanical force on precision and ultra-precision cutting machines.
The processing material is extensive, the processing shape is complex, the processing precision is high, and the processing shape mainly depends on the tool and the machine tool to ensure.
4) Cylindrical cutting
Using the earlier cutting method, the blade is rotated at high speed to make contact with the silicon ingot to form a cut.
Due to the limitation of the cylindrical blade clamping method and blade stiffness, the cutting accuracy and flatness are reduced, and gradually replaced by other methods.
The above cutting methods have their own characteristics and are suitable for different semiconductor parts processing needs. In practical applications, it is necessary to select the appropriate cutting method according to the specific processing requirements and conditions.
